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Signed, Sealed, Delivered: Freescale Semiconductor Delivers Postage Stamp-Sized, Revolutionary Technology
Mobile Extreme Convergence is Here; Sampling With Customers
AUSTIN, Texas—(BUSINESS WIRE)—Feb. 1, 2005—
Smaller, more powerful, scalable, highly efficient ... and real.
Making good on its promise in October 2003, Freescale
Semiconductor, Inc. (NYSE:FSL) (NYSE:FSL.B) is successfully sampling
the revolutionary Mobile Extreme Convergence architecture with
Motorola, Inc., one of the top two handset manufacturers in the world.
The size of a postage stamp, Mobile Extreme Convergence (MXC) is
designed to significantly reduce the materials and development effort
required to deliver mid- and high-tier mobile devices. Designed to be
inserted in an existing footprint, MXC allows developers to use a
single platform to target multiple product designs currently delivered
through as many as 300-400 components.
This single platform could equip virtually any product -- an MP3
player, a handheld DVD player, a digital camera -- to become a fully
functional smart mobile cellular device.
MXC-enabled devices will use considerably less memory through a
shared memory approach and optimized cache environment. This, coupled
with the first combined single core modem (SCM) and high performance
applications processor on a single 90nm IC, results in up to 70
percent performance gain and 50 percent lower power over current
dual-core implementations.
MXC is the first wireless platform with L2 cache allowing faster
processing speed, higher performance and reduced power consumption by
minimizing the external memory bus accesses. With MXC, smart mobile
devices will be able to run longer on standard batteries, increasing
the utility and entertainment time for customers.
"Key to the innovation, Freescale cleanly separates the hardware
needed to drive call processing technology and application processing
in a miniature package," said Franz Fink, senior vice president and
general manager of Freescale's wireless business. "Not only does this
integration lower the chipset cost for our customers by at least 30
percent, it also eliminates the need for a stand-alone applications
processor."
This integration creates design space for a host of new
connectivity modules and applications such as WLAN, GPS, ZigBee(TM),
Bluetooth(TM), WiMAX or Ultra-Wideband mobile technologies. On-board
security solutions help protect consumers and enable widespread access
to anywhere, anytime downloads like video files and mobile commerce
transactions.
The MXC275-30 platform, the first instantiation of the MXC
architecture, is a comprehensive, integrated Single Core Modem GSM
Edge solution featuring:
-- ARM(R) ARM1136JF-S(TM) MCU @ 532 MHz, StarCore(R) SC140e DSP @
208 MHz.
-- Cutting edge modem features: EGPRS Class 12/GPRS Class 12 with
simultaneous voice and data covering the 850/900/1800/1900 MHz
bands.
-- Advanced Multimedia and graphics support include up to CIF
30fps MPEG4/H.264 Video Streaming Image Capture.
-- Enhanced security architecture is designed to prevent user
identity theft, provide SIM-locks, program and data integrity
and hardware features to support for digital rights
management.
-- Advanced Power Reduction Architecture.
-- Transceiver with direct conversion RF receiver and polar
modulated direct digital conversion transmitter including an
analog front end solution and PA module.
-- Advanced power management includes stereo DAC and Touch panel
interface.
-- Open OS, PSAPI (platform services API), Single Core Modem SW.
The MXC275-30 platform is sampling with alpha customers and will
be production-ready by the end of 2005. MXC-enabled products could be
shipping by early 2006.
For more information, please visit our website:
www.freescale.com/mxc.
About Freescale Semiconductor
Freescale Semiconductor, Inc. (NYSE:FSL) (NYSE:FSL.B) is a global
leader in the design and manufacture of embedded semiconductors for
the automotive, consumer, industrial, networking and wireless markets.
Freescale became a publicly traded company in July 2004 after more
than 50 years as part of Motorola, Inc. The company is based in
Austin, Texas, and has design, research and development, manufacturing
or sales operations in more than 30 countries. Freescale, a member of
the S&P 500(R), is one of the world's largest semiconductor companies
with 2004 sales of $5.7 billion (US). www.freescale.com
Freescale Technology Forum
Learn more about this inaugural forum, June 20-23, Orlando,
Florida, featuring visionary keynote speeches, in-depth technical
presentations and technology demonstrations from Freescale and leading
hardware, software and tools providers. www.freescale.com/ftf
Freescale(TM) and the Freescale logo are trademarks of Freescale
Semiconductor, Inc. All other product or service names are the
property of their respective owners. ARM is the registered trademark
of ARM Limited. ARM1136JF-S(TM) is the trademark of ARM Limited. (C)
Freescale Semiconductor, Inc. 2005.
Contact:
Freescale Semiconductor, Inc., Austin
North America:
Lois Paul & Partners for Freescale Semiconductor
Donna Keenan, +1-781-782-5791
Donna_Keenan@LPP.com
or
Europe, Middle East and Africa:
Regina Cirmonova, +41-22-799-1258 (office)
regina.cirmonova@freescale.com
or
Asia Pacific:
Gloria Shiu, +852-2666-8237
gloria.shiu@freescale.com
or
Japan:
Koichi Yoshimura, +81-3-3280-8672
koichi.yoshimura@freescale.com
or
Latin America:
Ruth Ruiz, +1-480-814-4897
Ruth.Ruiz@freescale.com
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